It is to informed that SENIN obtained a U.S. patent for hermetic connector. The patent based on so-called ‘Air Bridge’ MID techinology can realize zero dissipation tangent. This technology is suitable for beyond 5G Smartphone antenna,Automotive antenna/sensor/camera,High speed commnication application and Medical. Our MID technology can also wire and mount electric devices on the surface…

We have recently updated the documents. Please kindly download it on our website.Our 3D MID makes your applications PCBless,FCBless and Harnessless. The newly released documents include more detailed overview of our latest technologies,product information and solution ever than before. We will continue striving to deliver valuable information to support your business. Our 3D MID solution…

It is to inform that we have been published in newsletter of JETRO（Japan External Trade Organization).       Please refer to below URL and download Mobility Startups Market Map. Unveiling the Latest in the Japanese Startup Ecosystem: JETRO Launches 11 Market Maps Spanning Different Industry Sectors! | News & Updates – Japan External Trade Organization –…

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We are pleased to announce that we have entered into a distributorship agreement with Maxmega Corporation. Maxmega is an electronic components trading company based in Singapore with offices in China, Hong Kong, India, Malaysia, Taiwan, and Thailand. We will continue to expand our business globally in the future. ▼Here is Maxmega’s URL ▼ Brand –…

We are pleased to inform you that our company has obtained ISO 9001 certification, as outlined below. We will continue to strive towards quality management in the production of our 3D-MID products. Date of Registration: March 30th, 2022 Registration Number：QC21J0027 ISO9001：2015・JIS　Q9001：2015 Design of 3D Molded Interconnect Devices (MID)・Development and Manufacturing Management

We are pleased to announce that our company has joined the 3-D MID e.V., the oldest 3DMID research association in Germany. Through our membership in this association, we aim to contribute to the development of the 3D-MID industry and to realize a better society by meeting the needs of customers around the world who share…