Consumer | Senin technologies

Smart phone

With the evolution of AI, the role of IoT edge sensors is expanding rapidly and one of the key technological challenges is to achieve lightweight and compact designs.
Senin Technologies provides solutions for composite integration and lightweighting, particularly for applications like smartphone antennas, by utilizing low-dielectric tangent molded materials.
We contribute to creating a people-friendly smart society through our advanced micro ３D patterning technology and highly flexible design capabilities.

Gaming device

We are capable of proposing MID and 3D integration solutions for sensor packages such as LED reflectors, USB/SD/PD sockets, RFID sensors and more.
We can accommodate your 3D MID concept even at the sketch level.
If you are seeking to reduce harnesses, FPC and PCBs, or even if you are unfamiliar with 3D MID products, please feel free to consult with us.

Smart speaker

With the advancement of AI, the role of IoT edge sensors is expanding and lightweighting and miniaturization have become key technological challenges.
Senin Technologies can address these challenges through the use of 3D MID products, enabling highly flexible designs and simplifying our customers' manufacturing processes.

VR goggles

We contribute to lightweighting, miniaturization, and integration by eliminating PCBs, cables, and flex circuits in VR goggles, digital glasses, and similar devices. Instead, we implement 3D wiring directly on injection-molded parts.
Our company provides comprehensive solutions for 3D MID, including consulting, design, specification development, manufacturing, and 3D mounting. We can accommodate your 3D MID concept even at the sketch level.
If you are seeking to reduce harnesses, FPCs, and PCBs, achieve product lightweighting or even if you are unfamiliar with 3D MID products, please feel free to consult with us.