センインテクノロジーズ株式会社

Smartphones

Smartphones

Smartphones

5G/6G smartphones require compact, lightweight, and highly integrated components for antennas, cameras, and sensors.

[ Applications ]
• Smartphone Antennas and Camera Actuators
• Sensors and RF Communication Components

SENIN TECHNOLOGIES' smartphone 3D MID solutions enable high-density integration through fine 3D routing, low-loss designs, and Air Bridge technology.

[ Features ]
• Fine 3D Circuit Routing Technology
• High-Density Integration
• Low-Loss RF Design

Consumer Electronics

Consumer Electronics

Consumer devices require compact, lightweight, and highly integrated designs for connectors, antennas, and sensors.

[ Applications ]
• USB, SD Card, and Power Connectors
• LED Reflectors, Sensors, and Antennas

SENIN TECHNOLOGIES' 3D MID solutions integrate multiple functions into a single component, reducing assembly complexity while supporting high-density integration and compact designs.

[ Features ]
• Integrated Connector and Antenna Designs
• High-Density Integration
• Multi-Function Component Integration

Smart Speakers

Smart Speakers

AI voice recognition and IoT technologies require compact, highly integrated designs for antennas, sensors, LEDs, and audio components.

[ Applications ]
• Wi-Fi / Bluetooth Antennas
• LEDs, Sensors and Voice Recognition Components

SENIN TECHNOLOGIES' 3D MID solutions enable space-saving designs by integrating antennas and sensors while preserving acoustic space.

[ Features ]
• Space-Saving Design for Audio Devices
• Reduced Wiring and Component Count
• Efficient Use of Limited Internal Space

Smart Glasses & Wearables

Smart Glasses & Wearables

AR/VR and wearable devices require lightweight, compact, and highly integrated designs.

[ Applications ]
• Smart Glasses and AR/VR Headsets
• Smart Rings and Wearable Devices

SENIN TECHNOLOGIES' 3D MID solutions enable high-density integration of antennas, sensors, LEDs, and electronic components on curved surfaces while reducing PCBs, FPCs, and wire harnesses.

[ Features ]
• Fine 3D Circuit Routing on Curved Surfaces
• High-Density Integration in Limited Spaces
• Lightweight and Space-Saving Designs