センインテクノロジーズ株式会社

Industrial & Semiconductor

Industrial & Semiconductor

Industrial and semiconductor applications require high-speed communication, high reliability, and compact integration for sensors, connectors, and advanced electronic components.

[ Applications ]
• FA Sensors, Robotics Components, and AI Server Connectors/Switches
• AGV Components, Edge AI Modules, and Semiconductor Devices

SENIN TECHNOLOGIES' 3D MID solutions enable fine 3D routing and reliable assembly for sensors, robotics, and semiconductor-related applications.

[ Features ]
• Fine 3D Circuit Routing Technology
• High-Reliability Assembly
• Compact and High-Density Integration

Biometric & Presence Sensors

Biometric & Presence Sensors

Advanced sensing applications require high accuracy, fast response, and compact integration.

[ Applications ]
• Fingerprint, Iris, and Vein Recognition Sensors
• Presence Detection Sensors

SENIN TECHNOLOGIES' 3D MID solutions enable high-density integration and precise assembly while improving sensor accuracy and reducing noise.

[ Features ]
• Fine 3D Circuit Routing Technology
• High-Precision Assembly
• Noise Reduction Design

CO2 Sensors

CO2 Sensors

CO₂ sensing applications require high accuracy, fast response, and long-term stability for environmental monitoring and industrial control systems.

[ Applications ]
• CO₂ Sensors and Environmental Monitoring Devices
• HVAC Control Systems and Industrial Sensing Equipment

SENIN TECHNOLOGIES' 3D MID solutions enable stable and accurate sensing performance, even under temperature variations and long-term operating conditions.

[ Features ]
• High Dimensional Accuracy
• Long-Term Stable Operation
• Designs for Low-Concentration Detection

Robot Arms

Robot Arms

Collaborative robots and physical AI systems require reliable wiring, sensor integration, and compact designs for complex multi-joint structures.

[ Applications ]
• Robotic Arms and Robotic End Effectors
• FA Sensors and Physical AI Components

SENIN TECHNOLOGIES' 3D MID solutions enable efficient 3D routing for moving parts while reducing wire harnesses, FPCs, and circuit boards.

[ Features ]
• Fine 3D Circuit Routing Technology
• Reliable Designs for Moving Components
• Reduced Wiring and Improved Assembly Efficiency

AGV Systems

AGV Systems

AGV systems require reliable sensing, sensor integration, and safe operation for automated logistics and smart factory environments.

[ Applications ]
• AGV Sensor Modules and Obstacle Detection Sensors
• Positioning Systems and Factory Automation Components

SENIN TECHNOLOGIES' 3D MID solutions enable multi-sensor integration and reliable 3D routing while reducing wire harnesses, FPCs, and circuit boards.

[ Features ]
• Multi-Sensor Integration
• Reliable Wiring Design
• Optimized Cable Routing and Assembly