It is to informed that SENIN obtained a U.S. patent for hermetic connector.
The patent based on so-called ‘Air Bridge’ MID techinology can realize zero dissipation tangent.
This technology is suitable for beyond 5G Smartphone antenna,Automotive antenna/sensor/camera,High speed commnication application and Medical.
Our MID technology can also wire and mount electric devices on the surface or vertical plane of connector.
Registration number:7625270
Registration date:24/1/2025
Please feel free to contact us regarding the detail.
This is a company brochure that clearly summarizes the details of our comprehensive 3D MID total solution services. It also includes information on design rules and molding materials, so please take a look.